1. 2. 3. material content data sheet sales product name tle4209g issued 28. august 2013 ma# MA000982400 package pg-dso-14-22 weight* 142.94 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.173 2.22 2.22 22199 22199 leadframe inorganic material phosphorus 7723-14-0 0.015 0.01 106 non noble metal zinc 7440-66-6 0.060 0.04 422 non noble metal iron 7439-89-6 1.207 0.84 8443 non noble metal copper 7440-50-8 49.007 34.28 35.17 342841 351812 wire noble metal gold 7440-57-5 0.216 0.15 0.15 1510 1510 encapsulation organic material carbon black 1333-86-4 0.172 0.12 1206 plastics epoxy resin - 7.928 5.55 55462 inorganic material silicondioxide 60676-86-0 78.074 54.62 60.29 546185 602853 leadfinish non noble metal tin 7440-31-5 1.226 0.86 0.86 8578 8578 plating noble metal silver 7440-22-4 1.030 0.72 0.72 7204 7204 glue plastics acrylic resin - 0.184 0.13 1286 noble metal silver 7440-22-4 0.652 0.46 0.59 4558 5844 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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